★銘盛電子回收公司13631665055
高價回收電子工廠、積壓庫存等庫存電子呆滯料13631665055長期經(jīng)營專業(yè)回收：
(1) 電子元件：
IC、二三極管、電容、電阻、電感、電位器、連接器、晶振、濾波器、
變壓器、功率模塊、霍爾元件、發(fā)光管、直插DIP,貼片SMD、繼電器等。
(2) 數(shù)碼產(chǎn)品配件：
主控芯片、解碼芯片、收音模塊、音頻IC、電源管理芯片、充電器、
電池保護芯片、光接收管、激光頭、機芯、液晶屏、
CF卡、SD卡等。
(3) 手機配件：
內(nèi)存、芯片、震動器、主板、外殼、PCB光板、液晶屏、充電器、
數(shù)據(jù)線、藍牙適配器、SD、MMC卡、讀卡器、攝像頭等。
(4) 電腦配件：
主機板、顯卡、聲卡、網(wǎng)卡、MODEM、硬盤、存儲卡、光驅(qū)、鍵盤、鼠標、攝
像頭、顯示器、CPU、內(nèi)存芯片、內(nèi)存條、南北橋芯片、散熱器、連接器、
機箱、電源、UPS等。
聯(lián)系電話 13631665055 肖先生 QQ 1073735185
E-mail shuyun131421@
射頻功率放大器,RF PA,TD-SCDMA 1880-1920M/2010-2025M,10pad,3.0×3.0×0.85mm,N/A,SKY77198-12,SKYWORKS
MOS FET功放模塊,MOS FET PA module,Dual band Antenna Switch,34pin,6.0×8.0×1.0(max)mm,N/A,RPF89007B,RENESAS
射頻功率放大器,RF PA,WCDMA/HSDPA/HSUPA/HSPA+/LTE,10pin,3.0×3.0×0.9 mm,LTE-Band V (824-849MHz),SKY77704,SKYWORKS
音頻放大器,Audio PA,1.42×1.42mm,9-ball WCSP,2W,class D,SN2145IY09E,SI-EN
內(nèi)存芯片,MCP Memory,N/A,32 Gb,48 pin TSOP,20×12×1.2 mm,0.5 mm,3.3 V,NAND,H27UBG8T2BTR-BC,HYNIX
內(nèi)存芯片,Memory,Spi Flash,128Mbit,WSON8 6*5-mm,6.00×5.00×0.75 mm,1.27 mm,1.8 V,N/A,W25Q128FWPIM,WINBOND
內(nèi)存芯片,Memory,64M bit serial flash,,N/A,MLP8,6×5 mm,1 mm,1.8 V,N/A,N25W064A11EF640F,MICRON
內(nèi)存芯片,MCP Memory,e.MMC+LPDDR2 S4 SDRAM,4 GB e.MMC+4 Gb(256 Mb x 16),FBGA162 ball,11.5×13×1.0 mm,0.5 mm,N/A,N/A,KMNJS000FM-B205,SAMSUNG
內(nèi)存芯片,MCP Memory,DDR2 Mobile RAM,8Gb DDR2 Mobile RAM,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,POP,EDB8164B3PF-1D-F,ELPIDA
內(nèi)存芯片,MCP Memory,LPDDR2-S4 SDRAM+LPDDR2-S4,4Gb+ 4Gb,216-ball FBGA,12×12×0.8mm,0.40 mm,1.2 V,PoP,K3PE7E700M-XGC1,SAMSUNG
內(nèi)存芯片,MCP Memory,NAND Flash+Mobile DDR SDRAM,2Gb (128M x16)+1Gb (64M x16),153-ball FBGA,8×9×1.0mm,0.50 mm,1.8 V,N/A,K522H1HACF-B050,SAMSUNG
內(nèi)存芯片,MCP Memory,eMMC,4GB Emmc,153-ball FBGA,11.5×13×1.0mm,0.80 mm,1.8 V,MLC,KLM4G1FE3B-B001,SAMSUNG
內(nèi)存芯片,MCP Memory,eMMC,8GB Emmc,153-ball TFBGA,11.5×13×1.0mm,0.50 mm,1.8 V,N/A,KLM8G2FE3B-B001,SAMSUNG
內(nèi)存芯片,MCP Memory,NAND Flash+mobile DDR,2Gb+1Gb,P-TFBGA130-0809-0.65AZ,8.0×9.0×1.0mm,0.650 mm,1.8 V,N/A,TYAB0A111254KA20,TOSHIBA
內(nèi)存芯片,MCP Memory,NOR Flash+UtRAM2,128Mb +64Mb UtRAM2,84-ball FBGA,8×11.6×1.2mm,0.80 mm,1.8 V,N/A,K5L2866ATC-BQ12,SAMSUNG
內(nèi)存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
內(nèi)存芯片,MCP Memory,Flash+ PSRAM,32Mb(2M×16)+8Mb (512K×16),56-ball BGA,7×9×1.2mm,0.80 mm,1.8 V,N/A,FM91L03208UA-77BGE2B,ESMT
無線收發(fā)芯片,Transceiver,LFCSP-40,6×6×0.85mm,0.50 mm,N/A,AD6546,ANALOG DEVICES
基帶芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP，1.4GHz,MSM-8230-2-745PNSP-TR-02-0-AA,QUALCOMM
基帶芯片,Baseband Chipset,745PNSP,745 Balls,12×12×0.78mm,0.4 mm,N/A,W/O HDCP,MSM-8230-2-745PNSP-TR-02-0,QUALCOMM
基帶芯片,集成電路,Multimedia Device,S-PBGA-N547,547 Balls,12.00×12.00×0.90 mm,0.4 mm,Security,HS with TI dummy keys,X4460B5MCBS,TI
基帶處理芯片,Multimedia Baseband Processor,344-pin discrete package,N/A,11×11x1.0 mm,0.50 mm,Non-Security,N/A,21654GB1IFFBG,BROADCOM
集成電路,HEDGE Baseband Processor,FBGA,415.0 Balls,11×11 mm,N/A,Security,N/A,BCM2157B0KFB01G,BROADCOM
基帶處理芯片,Baseband Processor,PG-VF2BGA-221-1,626.0 Balls,7.5×7.5×1.0 mm,0.40 mm,Non-Security,N/A,PMB9811.BV1.0,INFINEON
基帶處理芯片,Baseband Processor,TFBGA,564.0 Balls,15×15×1.2 mm,0.3780 mm,Security,N/A,MT6516SA,MTK
基帶處理芯片,Baseband Processor,415-pin FBGA,N/A,11×11×1.2 mm,0.40 mm,Non-Security,N/A,BCM2157B0KFBG,BROADCOM
FM芯片,FM radio tuner,FM 65 to 108 MHz,24 pin QFN,4×4×0.9 mm ,0.50 mm,Non-Security,N/A,RDA5802E(F),RDA
射頻功率放大器,RF PA,UMTS Band1,10pin,3×3×1.0(typ)mm,N/A,ACPM-5201-TR1,AVAGO
內(nèi)存芯片,MCP Memory,NAND flash+ LPSDRAM,1Gb + 512Mb LPSDRAM,107-ball TFBGA,10.5×13×1.2mm,0.80 mm,2.6 V,N/A,NANDA9W3N6CZBB5E,NUMONYX
藍牙/FM芯片,BT with FM Receiver,BT 2.1 with FM Receiver,64-PIN WLBGA,3.374×3.344×0.55 mm,0.40 mm,Non-Security,N/A,BCM20780B0KUBG,BROADCOM
模擬開關(guān),SPDT Switch,1.5×1.5×0.4mm,12pin,N/A,XM0860ST-DL1201,MURATA
發(fā)射器,Transmit Module,Dual Band GSM850/PCS1900,23pin,6.63×5.24×1.0 mm,N/A,RF7167,RFMD
發(fā)射器,Transmit Module,Dual band GSM900/DCS1800,23pin,6.63×5.24×1.0 mm,N/A,RF7166,RFMD
發(fā)射器,Transmit Module,EGSM900/DCS1800/PCS1900,23pin,6.63×5.24×1.0 mm,N/A,RF7163,RFMD
無線收發(fā)芯片,EDGE RF single chip,LFCSP-40,6×6×0.85mm,0.50 mm,N/A,AD6546BCPZ,ANALOG DEVICES
PA模組,Module with Power Amplifier and Integrated Duplexer,WCDMA Mini PAiD 850,,DGD019M01, (B30312-D2017-Q121),EPCOS,
前端集成模塊,SAW Front End Module,GSM/WCDMA SAW Front End Module,24pin,4.5×3.2mm,N/A,B30674-D5017-Q824,EPCOS
前端集成模塊,Front End Module,GSM900/1800 dual band,20pin,5.5×5.5×1.2mm,N/A,RPF88130B,RENESAS
無線收發(fā)芯片,GSM/GPRS/EDGE RF transceiver,QFN40,6×6×0.85mm,0.50 mm,N/A,MT6140AN/DRC-L,MTK
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