特點:
設(shè)備采用高精度影像和光學系統(tǒng)以及精密自動對位工作臺,一體化的設(shè)計減少了多次搬運造成的污染和加工誤差,提高了設(shè)備的精度和生產(chǎn)效率。
Equipment using high-precision imaging and optical systems and precision automatic alignment table, integrated design reduces pollution and machining errors caused by repeated handling, improve the accuracy and efficiency of the device.
用途:
適用于IC TO LCM的COG邦定:FPC TO LCD的FOG邦定一體化設(shè)備。
Suitable for IC TO LCM of COG bonding: FPC TO LCD of FOG bonding equipment integration.
技術(shù)參數(shù):
電源:AC220V±10%,50Hz,8000W
工作環(huán)境:20℃+/-5℃,干凈,無塵,潔凈房
工作氣壓:0.5~0.7Mpa、干燥氣源
加熱方式:恒溫加熱
適合尺寸:1.77”~7”
影像處理:自動影像處理系統(tǒng)
外形尺寸:L:10000mm W:1200mm H:1900mm
熱壓頭尺寸:L:5~80mm W:1~6mm
ACF貼附精度:X≤±0.2mm Y≤±0.1mm
COG預(yù)壓精度:≤±0.003mm
COG本壓精度:≤±0.005mm
FOG預(yù)壓精度:≤±0.025mm
FOG本壓精度:≤±0.025mm
工藝流程:
自動上料→機械定位→剝離清潔→ACF膠貼附
IC自動上料→IC校正→IC拍照 →對位預(yù)壓→IC本壓→ ACF膠貼附
FPC人工上料→FPC拍照→FPC預(yù)壓→FPC本壓→自動下料