韓國盤石TAD-200S點(diǎn)膠機(jī)
??真空回吸功能,能有效解決低黏度液體點(diǎn)膠后滴流現(xiàn)象。
?配備多種接口方式,方便與自動化設(shè)備連接。
?采用數(shù)字顯示方式方便精密調(diào)整吐膠時(shí)間。
?自動存儲設(shè)定參數(shù),即使斷電也無需重新設(shè)置。
■適用材料
Cream Solder, Silver Paste, Epoxy, Bond, UV Resin, Silicone, Chip Bond, Oil等
■ Specification
Input Pressure
0~10㎏/?, 0~2㎏/?
Time Range
00.01~99.99sec
Interval Timer
0.01~3.99sec, 0.01~05.99min
Vacuum Pressure
0~-350mmHg, 0~-680mmHg
Out Signal
Open connector, DC24V, 20mmsec(Relay)
Power Source
AC220V 50/60Hz, AC100V 50/60Hz
Power Consumption
32W
Weight
4.9㎏