1.銅基:采用進(jìn)口精煉韌性無(wú)氧銅/T2紫銅,含銅量≥99.99%,導(dǎo)電率≥98%
2.銅基電阻率:無(wú)氧銅≤0.0165Ωmm2/m,T2紫銅≤0.0172Ωmm2/m
3.涂層成分: 62%Sn36%Pb2%Ag
4.涂層厚度:?jiǎn)蚊嫱繉?.01~0.05mm,涂層均勻,表面光亮、平整
5.涂層熔點(diǎn):179℃
6.抗拉強(qiáng)度:≥200N/mm2
7.延伸率:≥20%
1.Copper:Imported oxygen free or T2 copper ,Cu≥99.99%,Conductivity≥98%
2.Resistivity:Oxygen free copper≤0.0165Ωmm2/m,T2 copper≤0.0172Ωmm2/m
3.Coat Component: 62%Sn36%Pb2%Ag
4.Coat Thickness(Single side):0.01~0.05mm,uniform,smooth,bright
5.Coat Melting Point:179℃
6.Tensile Strength:≥200N/mm2
7.Elongation:≥20%